Market Overview:
The electronic adhesives are used in printing circuit
boards, which are then used in many applications such as automotive, medical
devices, cell phones, computer storage, and aerospace among others. The growing
demand from the developing region across the globe are the major factors
driving the global market for electronic adhesive.
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The growing government investments in the development of
electronic sector coupled with the augmenting investment in the retail sector
are other factors contributing to the growth of the market. Among the various
application, printing circuit boards are the dominant segment and are expected
to show the same trend during the forecast years. The growing demand for
printing circuit boards from applications such as wire tracking, chip bonding,
and potting among others is contributing substantially to the growth of the
segment.
Competitive Analysis
Some of the prominent players operating in the Global Electronic
Adhesive Market are 3M Company (U.S.), Alent PLC (U.K), BASF SE
(Germany), H.B. Fuller Company (U.S.), Henkel AG & Co. KGaA (Germany),
Indium Corporation (U.S.), LG Chemical Limited (South Korea), Mitsui Chemicals
(Japan), Hitachi Chemicals Company Limited (Japan), The Dow Chemicals Company
(U.S.), and Kyocera Chemical Corporation (Japan) among others.
Market Segmentation
The global Electronic Adhesive Market is segmented into
form, type, and application. On the basis of the form, the market is segmented
into liquid electronic adhesive, solid electronic adhesive and paste electronic
adhesive. On the basis of the type, the global Electronic Adhesive Market is
segregated into electrically conducive, thermally conducive, UV curing, and
others. On the basis of the application, the market is further bifurcated into
printed circuit boards, semiconductor and the integrated circuit, and others.
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Market Scenario
The electronic conducive type segment is the leading type in
the market and is expected to show the same trend during the forecast years.
The electronic conductive adhesives also are known as ECA are used as efficient
substitutes for traditional lead solders. The advantages such as high electrical
conductivity, they have widely used microelectronic industry for packaging.
Regional Analysis
The global Electronic Adhesive Market is spanned across five
key regions: Latin America, Europe , North America, Asia Pacific and the
Middle East & Africa. Among these, Asia Pacific holds a major portion of
the market and is anticipated show a considerable CAGR during the
assessed period. The developing end-user industries in the region such as
electrical and automotive are expected to fuel the market growth. Moreover, the
favorable government policies such as tax benefit and incentives among others
has resulted in the shifting of the manufacturing base in the developing
regions of Asia Pacific The key counties attributing to this growth are
India, China, and Japan. North America is the dominant region for the
electronic market adhesive. The developed end-user industries coupled with the
growing adoption of electronic adhesive are the major factor contributing to
the growth of the market. The major countries attributing to this growth are
Canada, and U.S. European market of electronic adhesive is expected to show
steady growth during the forecast years. Industry. Moreover, the increasing use
of electronic adhesives in the automobile industry is driving the market in
this region.
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